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| Nichia STS-DA1-0204 SPECIFICATIONS FOR NICHIA CHIP TYPE WARM WHITE MODEL : NS4L107T LED NICHIA CORPORATION Nichia STS-DA1-0204 1.SPECIFICATIONS (1) Absolute Maximum Ratings Item Forward Current Pulse Forward Current Allowable Reverse Current Power Dissipation Operating Temperature Storage Temperature Dice Temperature Soldering Temperature IFP Conditions : Symbol IF IFP IR PD Topr Tstg Tj Tsld and Absolute Maximum Rating 60 80 85 0.96 -40 ~ + 85 -40 ~ +100 130 Reflow Soldering : 260C Duty 1/10 (Tc=25C) Unit mA mA mA W C C C for 10sec. Pulse Width 10msec. (2) Initial Electrical/Optical Characteristics Item Symbol Forward Voltage VF Luminous Flux v x Chromaticity Coordinate y Please refer to CIE 1931 chromaticity diagram. Condition IF=50[mA] IF=50[mA] IF=50[mA] IF=50[mA] Typ. (14.7) (33) 0.452 0.409 (Tc=25C) Max. Unit 16.0 V lm - (3) Ranking Item Forward Voltage Rank H Rank M Rank L Rank P13 Rank P12 Rank P11 Rank P10 Symbol VF Condition IF=50[mA] Min. 15.0 14.0 13.0 42.8 36.0 30.3 25.5 Luminous Flux V IF=50[mA] (Tc=25C) Max. Unit 16.0 V 15.0 14.0 51.0 42.8 lm 36.0 30.3 Forward Voltage Measurement allowance is 3%. Luminous Flux Measurement allowance is 7%. Color Ranks x y x y 0.3575 0.3612 0.3545 0.3408 0.3610 0.3850 0.3575 0.3612 (IF=50mA,Tc=25C) Rank d1 0.3780 0.3988 0.3970 0.4116 Rank d2 0.3720 0.3897 0.3714 0.3823 0.3897 0.3823 0.3822 0.3580 0.3720 0.3714 0.3667 0.3484 -1- Nichia STS-DA1-0204 x y x y x y x y 0.3897 0.3823 0.3822 0.3580 0.4255 0.4000 0.4129 0.3725 0.3988 0.4116 0.3897 0.3823 0.4255 0.4000 0.4129 0.3725 x y x y 0.4053 0.3907 0.3954 0.3642 0.4519 0.4086 0.4355 0.3785 Rank f4 0.4680 0.4970 0.4385 0.4466 Rank f6 0.4519 0.4770 0.4086 0.4137 0.4770 0.4137 0.4588 0.3838 Rank f3 0.4390 0.4680 0.4310 0.4385 Rank f5 0.4255 0.4519 0.4000 0.4086 Color Coordinates Measurement allowance is 0.01. Basically, a shipment shall consist of the LEDs of a combination of the above ranks. The percentage of each rank in the shipment shall be determined by Nichia. Correspondence table of Color Coordinates - Luminous Flux ranks Ranking by Luminous Flux Ranking by Color Coordinates P10 P11 P12 P13 d1, d2 e1, e2, f3, f4, f5, f6 Shaded ranks are available. 2.INITIAL OPTICAL/ELECTRICAL CHARACTERISTICS Please refer to "CHARACTERISTICS" on the following pages. 3.OUTLINE DIMENSIONS AND MATERIALS Please refer to "OUTLINE DIMENSIONS" on the following page. Material as follows ; Package : Ceramics Encapsulating Resin : Silicone Resin (with Diffused + Phosphor) Electrodes : Au Plating Die Heat sink : Ag Plating Copper 4.PACKAGING * The LEDs are packed in cardboard boxes after taping. Please refer to "TAPING DIMENSIONS" and "PACKING "on the following pages. The label on the minimum packing unit shows ; Part Number, Lot Number, Ranking, Quantity * In order to protect the LEDs from mechanical shock, we pack them in cardboard boxes for transportation. * The LEDs may be damaged if the boxes are dropped or receive a strong impact against them, so precautions must be taken to prevent any damage. * The boxes are not water resistant and therefore must be kept away from water and moisture. * When the LEDs are transported, we recommend that you use the same packing method as Nichia. -2- Nichia STS-DA1-0204 5.LOT NUMBER The first six digits number shows lot number. The lot number is composed of the following characters; - Year ( 7 for 2007, 8 for 2008 ) - Month ( 1 for Jan., 9 for Sep., A for Oct., - Nichia's Product Number - Ranking by Color Coordinates - Ranking by Luminous Flux - Ranking by Forward Voltage B for Nov. ) -3- Nichia STS-DA1-0204 6.RELIABILITY (1) TEST ITEMS AND RESULTS Test Item Resistance to Soldering Heat (Reflow Soldering) Solderability (Reflow Soldering) Thermal Shock Temperature Cycle Moisture Resistance Cyclic High Temperature Storage Temperature Humidity Storage Low Temperature Storage Steady State Operating Life Steady State Operating Life of High Temperature Steady State Operating Life of High Humidity Heat Steady State Operating Life of Low Temperature Permanence of Marking Standard Test Method JEITA ED-4701 300 301 JEITA ED-4701 300 303 JEITA ED-4701 300 307 JEITA ED-4701 100 105 JEITA ED-4701 200 203 JEITA ED-4701 200 201 JEITA ED-4701 100 103 JEITA ED-4701 200 202 Test Conditions Tsld=260C, 10sec. (Pre treatment 30C,70%,168hrs.) Tsld=215 5C, 3sec. (Lead Solder) 0C ~ 100C 15sec. 15sec. -40C ~ 25C ~ 100C ~ 25C 30min. 5min. 30min. 5min. 25C ~ 65C ~ -10C 90%RH 24hrs./1cycle Ta=100C Ta=60C, Ta=-40C Ta=25C, IF=60mA Tested with Nichia standard circuit board. Note 2 times Number of Damaged 0/22 1 time over 95% 20 cycles 100 cycles 10 cycles 1000 hrs. 1000 hrs. 1000 hrs. 1000 hrs. 1000 hrs. 500 hrs. 1000 hrs. 1 time 0/22 0/22 0/22 0/22 0/22 0/22 0/22 0/22 0/22 0/22 0/22 0/22 RH=90% Ta=85C, IF=40mA Tested with Nichia standard circuit board. 60C, RH=90%, IF=60mA Tested with Nichia standard circuit board. Ta=-40C, IF=50mA Tested with Nichia standard circuit board. JEITA ED-4701 500 501 JEITA ED-4701 400 403 JEITA ED-4701 300 304 Vibration Electrostatic Discharges Solvent : Isopropyl Alcohol Solvent Temperature : 20 ~ 25C Dipping Time : 5 min. 100 ~ 2000 ~ 100Hz Sweep 4min. 200m/s2 3directions, 4cycles R=1.5k, C=100pF Test Voltage=2kV 48min. 0/22 3 times Negative/Positive 0/22 Thermal resistance of LED with Nichia standard circuit board : Rja 70C/W Nichia standard circuit board : FR4, t=1.6mm, Copper foil, t=0.07mm (2) CRITERIA FOR JUDGING DAMAGE Criteria for Judgement Min. Max. Item Symbol Test Conditions Forward Voltage VF IF=50mA Initial Level Luminous Flux v IF=50mA Initial Level 0.7 The test is performed after the board is cooled down to the room temperature. -4- 1.1 Nichia STS-DA1-0204 7.CAUTIONS The LEDs are devices which are materialized by combining Blue LEDs and special phosphors. Consequently, the color of the LEDs is changed a little by an operating current. Care should be taken after due consideration when using LEDs. (1) Moisture Proof Package * When moisture is absorbed into the SMT package it may vaporize and expand during soldering. There is a possibility that this can cause exfoliation of the contacts and damage the optical characteristics of the LEDs. For this reason, the moisture proof package is used to keep moisture to a minimum in the package. * The moisture proof package is made of an aluminum moisture proof bag. A package of a moisture absorbent material (silica gel) is inserted into the aluminium moisture proof bag. The silica gel changes its color from blue to pink as it absorbs moisture. (2) Storage * Storage Conditions Before opening the package : The LEDs should be kept at 30C or less and 90%RH or less. The LEDs should be used within a year. When storing the LEDs, moisture proof packaging with absorbent material (silica gel) is recommended. After opening the package : The LEDs should be kept at 30C or less and 70%RH or less. The LEDs should be soldered within 168 hours (7days) after opening the package. If unused LEDs remain, they should be stored in the moisture proof packages, such as sealed containers with packages of moisture absorbent material (silica gel). It is also recommended to return the LEDs to the original moisture proof bag and to reseal the moisture proof bag again. * If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the storage time, baking treatment should be performed using the following condition. Baking treatment : more than 24 hours at 65 5C * This product has silver plated metal parts that are inside and/or outside the package body. The silver plating becomes tarnished when being exposed to an environment which contains corrosive gases. Any LED with tarnished leads may lead to poor solderability and deterioration of optical characteristics. Please do not expose the LEDs to corrosive atmosphere during storage. * After assembly and during use, silver plating can be affected by the corrosive gases emitted by components and materials in close proximity of the LEDs within an end product, and the gases entering into the product from the external atmosphere. The above should be taken into consideration when designing. * Please avoid rapid transitions in ambient temperature, especially in high humidity environments where condensation can occur. -5- Nichia STS-DA1-0204 (3) Static Electricity * Static electricity or surge voltage damages the LEDs. It is recommended that a wrist band or an anti-electrostatic glove be used when handling the LEDs. * All devices, equipment and machinery must be properly grounded. It is recommended that precautions be taken against surge voltage to the equipment that mounts the LEDs. * When inspecting the final products in which LEDs were assembled, it is recommended to check whether the assembled LEDs are damaged by static electricity or not. It is easy to find static-damaged LEDs by a light-on test or a VF test at a lower current (below 1mA is recommended). * Damaged LEDs will show some unusual characteristics such as the forward voltage becomes lower, or the LEDs do not light at the low current. Criteria : (VF > 8.0V at IF=0.5mA) (4) Application Design Considerations * In designing a circuit, the current through each LED must not exceed the absolute maximum rating specified for each LED. It is recommended to use Circuit B which regulates the current flowing through each LED. In the meanwhile, when driving LEDs with a constant voltage in Circuit A, the current through the LEDs may vary due to the variation in forward voltage (VF) of the LEDs. In the worst case, some LED may be subjected to stresses in excess of the absolute maximum rating. (A) ... (B) ... * This product should be operated in forward bias. A driving circuit must be designed so that the product is not subjected to either forward or reverse voltage while it is off. In particular, if a reverse voltage is continuously applied to the product, such operation can cause migration resulting in LED damage. * Thermal design of the end product is of paramount importance. Please consider the heat generation of the LED when making the system design. The coefficient of temperature increase per input electric power is affected by the thermal resistance of the circuit board and density of LED placement on the board, as well as other components. It is necessary to avoid intense heat generation and operate within the maximum ratings given in this specification. * Please determine the operating current with consideration of the ambient temperature local to the LED and refer to the plot of Ambient temperature vs. Allowable Forward Current on CHARACTERISTICS in this specifications. Please also take measures to remove heat from the area near the LED (heat sink) to improve the operational characteristics of the LED. * The equation 1 indicates correlation between Tj and Ta, and the equation 2 indicates correlation between Tj and Tc. Tj=Ta + Rja W 1 Tj=Tc + Rjc W 2 Tj = Dice Temperature : C, Ta = Ambient Temperature : C, Tc = Die Heat sink Temperature : C, Rja = Heat resistance from Dice to Ambient temperature : C /W, Rjc = Heat resistance from Dice to Tc measuring point 12C /W, W = Inputting Power (IF VF) : W -6- Nichia STS-DA1-0204 * Warpage of circuit board with soldered LEDs may result in damage or package breakage of the LEDs. Please pay special attention to the orientation of the LEDs as to avoid LED failure caused by bow, twist and warpage of the board. Non-preferable Cathode mark Preferable Cathode mark Solder connections Solder connections When mechanical stress from the board affects the soldered LED, place the LED in the preferable location and orientation as shown above. * Depending on the position and direction of LED, the mechanical stress on the LED package can be changed. Refer to the following figure. E Perforated line A C D B Slit Stress : A > B = C > D > E * When separating the circuit boards with soldered LEDs, please use appropriate tools and equipment. Hand brake without these tools and equipment may not be used. * The use of aluminum substrate increases stress to solder joints due to thermal expansion of substrate and subsequently may result in solder joint crack. Users may need to evaluate their specific application to determine any impact due to the use of aluminum substrate. -7- Nichia STS-DA1-0204 * Tweezers When handling it with tweezers, the product should only be held by the ceramics body, not by the encapsulant. Failure to comply might result in chip-out and/or delamination of encapsulant, and in the worst cases, catastrophic failure of the LEDs due to wire deformation and/or breakage. Encapsulant Ceramics body * Pick and Place Recommended conditions : Area of outer nozzle 2 mm2 (more than 30% of encapsulant top surface)** Contact area of nozzle with encapsulant 0.9 mm2 (15 to 85% of encapsulant top surface)** Placement pressure 3N/mm2 *max. force : 5N Vacuum pressure 7.8N/ cm2 ( 0.8 kgf/cm2) **For reference. Failure to comply might result in damage to encapsulant and in the worst cases, catastrophic failure of the LEDs due to wire deformation and/or breakage. -8- Nichia STS-DA1-0204 * Printed Circuit Board Assembled (PCB with LEDs soldered) Do not stack assembled PCBs together. Since silicone is a soft material, abrasion between two PCB assembled with silicone encapsulated LED might cause catastrophic failure of the LEDs due to damage to encapsulant (such as scratch, chip-out and delamination) and wire (such as deformation and breakage) and LED detachment. -9- Nichia STS-DA1-0204 Reflow Soldering Lead Solder Pre-heat Pre-heat time Peak temperature Soldering time Condition 10 sec. Max. refer to Temperature - profile 1. 10 sec. Max. refer to Temperature - profile 2. (N2 reflow is recommended.) 120 ~ 150C 120 sec. Max. 240C Max. Lead-free Solder 180 ~ 200C 120 sec. Max. 260C Max. Although the recommended soldering conditions are specified in the above table, reflow soldering at the lowest possible temperature is desirable for the LEDs. A rapid-rate process is not recommended for cooling the LEDs down from the peak temperature. [Temperature-profile (Surface of circuit board)] Use the conditions shown to the under figure. 2.5 ~ 5C / sec. Pre-heating 120 ~ 150C 60sec.Max. Above 200C 240C Max. 10sec. Max. 1 ~ 5C / sec. 1 ~ 5C / sec. Pre-heating 180 ~ 200C 60sec.Max. Above 220C 260C Max. 10sec. Max. 2.5 ~ 5C / sec. 120sec.Max. 120sec.Max. [Recommended soldering pad design] 4.0 2.8 Use the following conditions shown in the figure. 2.9 1.8 (Unit : mm) 1.8 4-R0.3 * Occasionally there is a brightness decrease caused by the influence of heat or ambient atmosphere during air reflow. It is recommended that the User use the nitrogen reflow method. * Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable, a hot plate should be used. It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing. * Reflow soldering should not be done more than two times. * Die Heat sink is to be soldered. * When soldering, do not put stress on the LEDs during heating. * After soldering, do not warp the circuit board. -10- Nichia STS-DA1-0204 -11- Nichia STS-DA1-0204 0.9 520 530 0.8 510 0.7 540 ICI Chromaticity Diagram 550 560 0.6 570 500 0.5 e1 f3 f4 580 590 600 610 620 630 y 0.4 d1 e2 f5 f6 d2 0.3 490 0.2 0.1 480 470 460 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0 x Color coordinates Measurement allowance is 0.01. -12- Forward Voltage vs. Forward Current Relative Luminous Flux (a.u.) Forward Current IFP (mA) 100 80 50 Ta=25C Forward Current vs. Relative Luminous Flux Allowable Forward Current IFP (mA) 2.0 Ta=25C 1.5 1.0 0.5 0 Duty Ratio vs. Allowable Forward Current Luminous Efficiency (lm/W) Luminous Flux (lm) 200 Ta=25C 100 80 60 Forward Current vs. Luminous Efficiency 100 Luminous Efficiency : Luminous Flux : 80 60 40 20 0 0 Ta=25C 10 5 20 10 1 1 8 10 12 14 16 18 Forward Voltage VF (V) 0 20 40 60 80 100 Forward Current IFP (mA) 5 10 20 50 100 Duty Ratio (%) 20 40 60 80 100 Forward Current IFP (mA) Ambient Temperature vs. Forward Voltage Relative Luminous Flux (a.u.) 18 Forward Voltage VF (V) 17 16 15 14 13 12 -60 -40 -20 0 20 40 60 80 100 Ambient Temperature Ta (C) IFP=50mA Ambient Temperature vs. Relative Luminous Flux 2.0 IFP=50mA 1.0 Allowable Forward Current IF (mA) Ambient Temperature vs. Allowable Forward Current 100 80 60 40 20 0 0 20 40 60 80 100 Ambient Temperature Ta (C) Thermal resistance Rja=70C/W -13- 0.5 0.2 -60 -40 -20 0 20 40 60 80 100 Ambient Temperature Ta (C) Nichia STS-DA1-0204 Model NS4L107 NICHIA CORPORATION Title No. CHARACTERISTICS 070821770141 Forward Current vs. Chromaticity Coordinate Relative Emission Intensity (a.u.) Spectrum 1.2 1.0 0.8 0.6 0.4 0.2 0 400 500 600 700 Wavelength (nm) 800 Ta=25C IF=50mA 0.43 Ta=25C 0.42 0.41 0.40 0.39 0.43 80mA 60mA 50mA 5mA 1mA y 0.44 0.45 0.46 0.47 x Ambient Temperature vs. Chromaticity Coordinate 0.43 IFP=50mA 0.42 -40C Directivity 1.0 Relative Illuminance (a.u.) 0 Ta=25C IFP=50mA 10 20 30 40 50 y -14- 0.41 0.40 0.39 0.43 85C 0C 25C 50C 0.5 60 70 80 0.44 0.45 0.46 0.47 0 90 x 60 30 Radiation Angle 0 0.5 90 1.0 Nichia STS-DA1-0204 Model NS4L107 NICHIA CORPORATION Title No. CHARACTERISTICS 070821770151 Cathode mark 3.5 2.8 1.5 0.8 2 Die Heat sink Cathode 4-R1 Anode 2.9 0.1 3.3 0.1 A 2.8 0.1 K Protection device 3.5 2.8 ITEM PACKAGE ENCAPSULATING RESIN ELECTRODES DIE HEAT SINK MATERIALS Ceramics Silicone Resin (with Diffused + Phosphor) Au Plating Ag Plating Copper Model 2 -15- Note 1) NS4L107 has a protection device built in as a protection circuit against static electricity. Note 2) The die heat sink is electrically neutral. NS4L107 Unit mm 8/1 Scale Allow 0.2 Nichia STS-DA1-0204 NICHIA CORPORATION Title No. OUTLINE DIMENSIONS 080310811361 Taping part 1.5+0.1 -0 80.1 20.05 40.1 1.750.1 0.20.05 3.850.1 Reel part 180+0 -3 15.41 13+1 -0 5.50.05 Cathode mark 12+0.3 - 0.1 2 1 0.8 13 0.2 1.5+0.2 -0 3.850.1 20.1 Label XXXX LED LEDs mounting part TYPE NS4x107T LOT xxxxxxQTY pcs RoHS Reel End of tape No LEDs No LEDs 60+1 -0 Pull direction Top cover tape Embossed carrier tape -16Reel Lead Min.160mm (No LEDs) Reel Lead Min.100mm (No LEDs) Reel Lead Min.400mm 1,200pcs/Reel Taping is based on the JIS C 0806 : Packaging of Electronic Components on Continuous Tapes. Model NS4x107T Unit mm Scale Allow Nichia STS-DA1-0204 NICHIA CORPORATION Title No. TAPING DIMENSIONS 080501815611 Nichia STS-DA1-0204 The reel and moisture absorbent material are put in the moisture proof foil bag and then heat sealed. Reel Label Seal TYPE LOT QTY NICHIA XXXX LED NS4x107T xxxxxxPCS NICHIA CORPORATION 491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN RoHS Moisture absorbent material Moisture proof foil bag The box is partitioned with the cardboard. Label NICHIA Nichia LED XXXX LED TYPE RANK QTY NS4x107T PCS NICHIA CORPORATION 491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN RoHS Packing unit Moisture proof foil bag Cardboard box Cardboard box S Cardboard box M Cardboard box L Reel/bag 1reel Quantity/bag (pcs) 1,200 MAX. Reel/box 5reel MAX. 10reel MAX. 20reel MAX. Quantity/box (pcs) 6,000 MAX. 12,000 MAX. 24,000 MAX. Dimensions (mm) 291 237 120 8t 259 247 243 5t 444 262 259 8t Model NS4x107T NICHIA CORPORATION Title No. PACKING 070821770101 -17- |
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